Via fill compositions for direct attach of devices and methods f

Details Via fill compositions for direct attach of devices and methods f Via fill compositions for direct attach of devices and methods f

1995-06-06

1996-11-05

Ryan, Patrick

Stock material or miscellaneous articles

Structurally defined web or sheet

Including aperture

428209, 428210, 428198, 428323, 428901, 174167, B32B 900

Patent

active

055715931

ABSTRACT:
The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, the fill composition provides support for the solder joint and provides a flat solderable surface for the inter-connection. In certain embodiments, the cured fill compositions, offer a further advantage of being conductive. The invention also relates to several novel methods for filling through holes with such fill compositions, and to resistors located in through holes and vias.

REFERENCES:
patent: 3546015 (1970-12-01), Vulliez
patent: 3601523 (1971-08-01), Arndt et al.
patent: 3873756 (1975-03-01), Gall et al.
patent: 4008300 (1977-02-01), Ponn
patent: 4278706 (1981-07-01), Barry
patent: 4360570 (1982-11-01), Andreades et al.
patent: 4383363 (1983-05-01), Hayakawa et al.
patent: 4415607 (1983-11-01), Denes et al.
patent: 4442966 (1984-04-01), Jourdain et al.
patent: 4692272 (1987-09-01), Goswami et al.
patent: 5006673 (1991-04-01), Freyman et al.
patent: 5047368 (1991-09-01), Schnitker et al.
patent: 5098771 (1992-03-01), Friend
patent: 5133120 (1992-07-01), Kawakami et al.
patent: 5198965 (1993-03-01), Curtis et al.
patent: 5207865 (1993-05-01), Satoh
patent: 5288541 (1994-02-01), Blackwell et al.
patent: 5350811 (1994-09-01), Ichimura et al.

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