Via fill compositions for direct attach of devices and method fo

Details Via fill compositions for direct attach of devices and method fo Via fill compositions for direct attach of devices and method fo

1998-12-18

2000-08-22

Watkins, III, William P.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

29852, 29840, 2281801, 428138, 428139, 428901, H05K 340, H05K 342

Patent

active

061068918

ABSTRACT:
The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, the fill composition provides support for the solder joint and provides a flat solderable surface for the inter-connection. In certain embodiments, the cured fill compositions, offer a further advantage of being conductive. The invention also relates to several novel methods for filling through holes with such fill compositions, and to resistors located in through holes and vias.

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IBM Technical Disclosure Buleetin, vol. 30, No. 7, p. 135, Dec. 1987.

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