Via configuration with decreased pitch and/or increased routing

Details Via configuration with decreased pitch and/or increased routing Via configuration with decreased pitch and/or increased routing

1997-12-03

2000-03-14

Sough, Hyung Sub

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174265, 29852, 257698, 361777, H05K 100

Patent

active

060375477

ABSTRACT:
A number of non-circular vias are defined in a printed wiring board layer. The vias are preferably elliptical, with their long dimensions oriented at an angle to the primary axes of the via or grid array. By providing elongated, non-circular vias, it is possible to decrease the pitch of the via array, or provide improved routing of escape traces.

REFERENCES:
patent: 5784262 (1998-07-01), Sherman

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