VIA configurable architecture for customization of analog...

Semiconductor device manufacturing: process – Making device array and selectively interconnecting

Reexamination Certificate

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Reexamination Certificate

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07449371

ABSTRACT:
A semiconductor device having a plurality of layers and a plurality of circuit elements arranged in tiles. At least one of the plurality of layers in the semiconductor device may be a via layer configured to determine the connections of the plurality of circuit elements. The semiconductor device may include an interconnection quilt having a plurality of metal layers disposed to interconnect the plurality of circuit elements. The plurality of circuit elements may be analog circuit element and/or digital circuit elements. The tiles may be analog tiles and digital tiles that form a mixed signal structured array.

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