Via capacitors within multi-layer, 3 dimensional structures/subs

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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357 80, 174 524, H01L 3902, H05K 500, H01G 410

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active

050559664

ABSTRACT:
A capacitor structure in a hybrid multilayer circuit having a plurality of insulating layers, the capacitor structure including a dielectric via fill in a via formed in one of the insulating layers, a first conductive element overlying the dielectric via fill, and a second conductive element underlying said dielectric via fill. Each of the first and conductive elements comprises a conductive via fill or a conductive trace.

REFERENCES:
patent: 4608592 (1986-08-01), Miyamoto
patent: 4641425 (1987-02-01), Dubuisson et al.
patent: 4792779 (1988-12-01), Pond et al.
patent: 4924353 (1990-05-01), Patraw
patent: 4925723 (1990-05-01), Bujatti et al.
patent: 4995941 (1991-02-01), Nelson et al.

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