Via and via landing structures for smoothing transitions in...

Details Via and via landing structures for smoothing transitions in... Via and via landing structures for smoothing transitions in...

2006-01-31

2006-01-31

Cuneo, Kamand (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C361S788000

Reexamination Certificate

active

06992255

ABSTRACT:
An integrated circuit arrangement or package includes a set of contact pads arranged in a pattern and a multi-layer conductive structure, which electrically connects the set of contact pads to at least one signal line. The conductive structure provides impedance matching between the pads and the at least one signal line.

REFERENCES:
patent: 5436412 (1995-07-01), Ahmad et al.
patent: 6617943 (2003-09-01), Fazelpour
patent: 6700457 (2004-03-01), McCall et al.
patent: 6710258 (2004-03-01), Oggioni et al.

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