Via adhesion in multilayer MEMS structure

Details Via adhesion in multilayer MEMS structure Via adhesion in multilayer MEMS structure

2006-07-04

2006-07-04

Ben, Loha (Department: 2873)

Optical: systems and elements

Optical modulator

Light wave temporal modulation

C359S291000, C359S292000

Reexamination Certificate

active

07072094

ABSTRACT:
A method of fabricating improved vias in a multilayer MEMS device. Via seats are patterned into first layer, such that each via will have a via seat at the bottom of the via opening. The via openings are then patterned into a second layer. A third layer of material is deposited, such that the material at least partly fills the via opening and the via seat. The material forms a support post that is anchored to the first layer by means of the material in the via seat.

REFERENCES:
patent: 2003/0095318 (2003-05-01), DiCarlo et al.

Affiliated with

Also associated with

Rating

Via adhesion in multilayer MEMS structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Via adhesion in multilayer MEMS structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Via adhesion in multilayer MEMS structure will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3548212