Very thin multi-chip-package and method of mass producing the sa

Details Very thin multi-chip-package and method of mass producing the sa Very thin multi-chip-package and method of mass producing the sa

1998-07-13

2000-08-08

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438110, 438117, H01L 2144, H01L 2148, H01L 2150

Patent

active

061001139

ABSTRACT:
A substrate assembly and method of forming the substrate assembly having a very thin form factor and a large amount of manufacturing flexibility. A flexible tape has a number of device blocks. Devices, passive or active, are joined to the device blocks forming a flexible tape assembly and the flexible tape assembly is electrically tested. Substrates are formed having cavities matching the device blocks. The flexible tape assembly is then joined to the substrate such that the devices fit into the cavities, thereby forming a substrate assembly having a very thin form factor. The flexible tape can be stored on a reel and the substrates can be formed in an array and cut to the desired size providing manufacturing flexibility.

REFERENCES:
patent: 5147210 (1992-09-01), Patterson et al.
patent: 5150274 (1992-09-01), Okada et al.
patent: 5239448 (1993-08-01), Perkins et al.
patent: 5578526 (1996-11-01), Akram et al.
patent: 5587341 (1996-12-01), Masayuki et al.
patent: 5602419 (1997-02-01), Takeda et al.
patent: 5620928 (1997-04-01), Lee et al.
patent: 5648679 (1997-07-01), Chillara et al.
patent: 5904499 (1999-05-01), Pace
Chang et al. "ULSI Technology", The McGraw-Hill Companies, 1996 p573-582.
Baggerman et al. "Reliable Au-Su FlipClip Bonding on Flexible Prints", 0569-55031 94/0000-0900 1994IEEE, 1994 p900-905.
Milkovich et al, "Double Sided Flexible Carrier with Discretes and Thermally Enhanced FCA/COF", 0569-5503/93/0000-0016, 1993 IEEE, p16-21.
"Adhesive Based FlipChip Technology for Assembly on Polymide Flex Substrates" 1997, International Conf. on Multichip Modules, p81-86.
Peter-Elenius, "Flex on Cap-Solder Paste Bumping", 1997 International Symposium on Advanced Packaging Materials, p115-116.
R.Aschenbremen "Flip Chip Attachment Using Anisotropic Conductive Adhesives and Electroless Nickel Bumps" 1996 IEEE/CMPT Int'l Electronics Manufacturing Tech Symp. p26-33.
A. Aintila et al, "Electroless Ni/Au Bumps for Flip Chip-on-Flex and TAB Applications", 1994 IEEE/CMPT Int'l Electronics Manufacturing Technology Symposium, p160-164.

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