Very high speed large system integration chip package and struct

Details Very high speed large system integration chip package and struct Very high speed large system integration chip package and struct

1981-08-14

1983-10-18

James, Andrew J.

Stock material or miscellaneous articles

Composite

Of bituminous or tarry residue

357 70, 357 68, 29576R, 29589, 428620, H01L 3902, H01L 2348, H01L 2944

Patent

active

044109067

ABSTRACT:
A package and system for elimination or reduction to a minimum of reflection of the signal when transmitting from a substrate into an integrated circuit package at very high speed. This is accomplished by providing a conductor grid at a proper distance from a conductor plane to act as a reference ground plane. The grid is designed so that the difference of coefficient of expansion of the ceramic insulator and the metal conductors, which results in the deformation of the plane substrate surface due to "bimetallic" effects, is essentially cancelled due to the symmetrical construction with about the same amount of the same metal placed on both sides of the ceramic substrate. In this way, forces provided due to the thermal mismatch are mutually cancelled.

REFERENCES:
patent: 3648122 (1972-03-01), Berglund et al.
patent: 4366342 (1982-12-01), Breedlove

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