Very high density wafer scale device architecture

Details Very high density wafer scale device architecture Very high density wafer scale device architecture

1990-03-30

1993-10-12

Thomas, Tom

Fishing, trapping, and vermin destroying

437 8, 437 48, 437 52, 437228, H01L 2170

Patent

active

052525074

ABSTRACT:
This invention relates to the design and manufacture of a wafer-size integrated circuit. Lower layers of the wafer sized integrated circuit comprise electrically isolated repeating blocks such as logic elements or blocks of circuit elements. An upper conductive layer comprises data and address bus structures. A discretionary via layer located between the upper layer and the lower layers can be patterned to accomplish multiple purposes. Patterning of the via layer avoids connecting the bus structure to defective elements or blocks, establishes addresses of elements, and establishes the organization of the addressing structure and data structure (for a memory wafer the word length, number of banks of words, and number of words per bank). The via layer is patterned to connect the upper bus lines to selected regions in the lower metal levels after testing (testing uses conventional techniques) for good and bad elements.

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