Very high bandwidth electrical interconnect

Electrical connectors – Including elastomeric or nonmetallic conductive portion – Adapted to be sandwiched between preformed panel circuit...

Reexamination Certificate

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Reexamination Certificate

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06854986

ABSTRACT:
A very high bandwidth electrical interconnect for conducting signals at high frequency. The interconnect includes a number of separate fine wire structures. Each such fine wire structure is made up of a string of generally spherical elements, each such element having a ferromagnetic core and a conductive coating over the core. The interconnect also includes an insulating medium surrounding the wire structures.

REFERENCES:
patent: 4832051 (1989-05-01), Jarvik et al.
patent: 20020180572 (2002-12-01), Kakehashi et al.
patent: 20030176083 (2003-09-01), Li et al.

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