Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Patent
1997-06-27
1999-02-02
Picardat, Kevin
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
438106, H01L 2144
Patent
active
058664432
ABSTRACT:
Disclosed is an integrated circuit configuration including a carrier having recesses for supporting individual semiconductor die units. The semiconductor die units and the carrier recesses have lithographically defined dimensions so as to enable precise alignment and a high level of integration.
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Greschner Johann
Kalter Howard Leo
Pogge H. Bernhard
Rosner Raymond James
Abate Joseph P.
International Business Machines - Corporation
Picardat Kevin
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