Very dense integrated circuit package and method for forming the

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices

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438106, H01L 2144

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active

058664432

ABSTRACT:
Disclosed is an integrated circuit configuration including a carrier having recesses for supporting individual semiconductor die units. The semiconductor die units and the carrier recesses have lithographically defined dimensions so as to enable precise alignment and a high level of integration.

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