Vertically stacked circuit module using a platform having a slot

Details Vertically stacked circuit module using a platform having a slot Vertically stacked circuit module using a platform having a slot

1997-02-26

1999-01-05

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257686, 361735, 361803, H01R 2372, H01R 909, H05K 114

Patent

active

058569154

ABSTRACT:
A circuit module for use in an implantable cardiac stimulation device contains a plurality of stacked substrate platforms. Electrical components of a hybrid circuit structure are attached to respective mounting surfaces of the substrate platforms. Electrical connectivity between components mounted on separate platform levels is established by connecting the components via wire bonds or other means. The wire bonds pass through a slot formed in an upper level substrate and are attached to electrical contacts of an associated lower level substrate.

REFERENCES:
patent: 5157588 (1992-10-01), Kim et al.
patent: 5172303 (1992-12-01), Bernardoni et al.
patent: 5198888 (1993-03-01), Sugano et al.
patent: 5222014 (1993-06-01), Lin
patent: 5373189 (1994-12-01), Massit et al.
patent: 5723907 (1998-03-01), Akram
patent: 5742477 (1998-04-01), Baba

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