Measuring and testing – Speed – velocity – or acceleration – Structural installation or mounting means
Patent
1994-02-01
1996-04-02
Williams, Hezron E.
Measuring and testing
Speed, velocity, or acceleration
Structural installation or mounting means
G01P 102
Patent
active
055030165
ABSTRACT:
Micro-machined accelerometer chips have a sensitive axis perpendicular to the principle surface of the device. In an application where the desired sensing direction is in the plane of a supporting printed circuit board, the accelerometer cannot be mounted directly on the printed circuit board and instead is mounted on a wall perpendicular to the printed circuit board. This requirement to wall-mount the sensor is eliminated by using an accelerometer chip packaged with a signal conditioning circuit in a multi layer ceramic chip carrier. Electrical connections are contained within the layers of the ceramic and terminate at a side surface of the chip carrier. Thus the accelerometer chip sits perpendicular to the printed circuit board and the ceramic chip carrier is attached directly thereto.
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"Airbags Boom When IC Accelerometer Sees 50 G", by Frank Goodenough, Electronic Design, Aug. 8, 1991.
IC Sensors Inc.
Klivans Norman R.
Oda Christine K.
Williams Hezron E.
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