Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Simultaneous deplating and plating
Reexamination Certificate
2005-04-26
2005-04-26
Nicolas, Wesley A. (Department: 1742)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Simultaneous deplating and plating
C205S220000, C205S117000, C427S331000, C427S346000, C427S372200, C118S500000, C118S730000, C118S409000, C134S032000, C134S153000, C134S143000
Reexamination Certificate
active
06884334
ABSTRACT:
The present invention relates to a containment chamber that is used for carrying out multiple processing steps such as depositing on, polishing, etching, modifying, rinsing, cleaning, and drying a surface on the workpiece. In one example of the present invention, the chamber is used to electro chemically mechanically deposit a conductive material on a semiconductor wafer. The same containment chamber can then be used to rinse and clean the same wafer. As a result, the present invention eliminates the need for separate processing stations for depositing the conductive material and cleaning the wafer. Thus, with the present invention, costs and physical space are reduced while providing an efficient apparatus and method for carrying out multiple processes on the wafer surface using a containment chamber.
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Nigorski Boguslaw A.
Talieh Homayoun
Uzoh Cyprian
Volodarsky Konstantin
Volodarsky Rimma
ASM Nutool, Inc.
Nicolas Wesley A.
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