Vertical wall elevated pressure heat dissipation system

Details Vertical wall elevated pressure heat dissipation system Vertical wall elevated pressure heat dissipation system

1981-06-30

1984-05-22

Davis, Jr., Albert W.

Heat exchange

Intermediate fluent heat exchange material receiving and...

Including means to move gaseous heat exchange material

357 82, 361383, F28D 1500, H01L 2346

Patent

active

044495803

ABSTRACT:
A heat dissipating system for cooling circuit chips or modules is described. The disclosed system includes circuit chips or modules which are vertically mounted, a gas at an elevated pressure being contained within an encased module for providing an enhanced thermal coupling between the chips or modules contained therein, and the walls of the encased module, whereby heat removal from the chips or modules is increased. This enhanced thermal coupling is combined with a reduction in the temperature of the walls of the encased modules so as to reduce the thermal resistance between the surrounding gas and the chips or modules to be cooled, whereby heat removal from the circuit chips or modules is substantially increased.

REFERENCES:
patent: 3487328 (1969-12-01), Katz
patent: 3638140 (1972-01-01), Knapp et al.
patent: 4069864 (1978-01-01), Novoryta et al.
patent: 4153107 (1979-05-01), Antonetti et al.
patent: 4246597 (1981-01-01), Cole et al.

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