Electric lamp and discharge devices: systems – Periodic switch in the supply circuit – Silicon controlled rectifier ignition
Reexamination Certificate
1999-02-09
2001-11-27
Wong, Don (Department: 2821)
Electric lamp and discharge devices: systems
Periodic switch in the supply circuit
Silicon controlled rectifier ignition
C438S619000, C438S639000, C313S325000, C257S522000
Reexamination Certificate
active
06323599
ABSTRACT:
FIELD OF THE INVENTION
The present invention is directed to an arrangement to alleviate the deleterious effects of electrostatic discharges in electronic circuits and more particularly, the present invention is directed to a vertical spark gap suitable for use in microelectronic circuits.
BACKGROUND OF THE INVENTION
Spark gaps have been proposed earlier in the art with the objective of counteracting electrostatic discharges on integrated circuits. Previous arrangements employed aluminum, however, due to the physical properties of the metal and especially its low melting point resulted in mass transport through and across the oxides and dielectrics and this was found to be problematic thus making aluminum an impractical choice.
Another limitation encountered in this field relates to the control of the breakdown voltage. Spark gaps are typically lateral and formed by photoengraving techniques. This process makes tolerances difficult to control leading to problems in forming short spark gaps.
Finally, limitations in successful operation of spark gaps in plastic packages are realized since the air in the gap is displaced by the plastic.
SUMMARY OF THE INVENTION
One object of one embodiment of the present invention is to provide a spark gap assembly suitable for use in electronic circuits, comprising:
a first at least partially conductive layer;
a second at least partially conductive layer;
nonconductive material positioned between the first layer and the second layer maintaining a vertically spaced relationship therebetween;
at least one opening in at least one of the first layer and the second layer, the nonconductive material removed from the layer having the at least one opening, whereby a vertical gap is formed between and communicates with each layer.
A further object of one embodiment of the present invention is to provide a spark gap assembly, comprising:
a first at least partially conductive layer;
a second at least partially conductive layer;
nonconductive material positioned between the first layer and the second layer maintaining a vertically spaced relationship therebetween, each layer in an overlying relationship with the material; and,
at least one opening in at least one of the first layer and the second layer, the nonconductive material removed from the layer having the at least one opening, the opening comprising a vertical spark gap for dissipating electrostatic charge.
As a further object of one embodiment of the present invention, there is provided a method of forming a vertical spark gap suitable for use in dissipating electrostatic buildup in an integrated circuit, comprising:
providing a first at least partially conductive layer and a second at least partially conductive layer;
positioning nonconductive material between the first layer and the second layer maintaining a vertically spaced relationship therebetween; and
forming at least one opening in one of the first or the second layer by etching insulating material associated with the first layer and the second layer to form a vertical gap therebetween.
Having thus described the invention, reference will now be made to the accompanying drawings illustrating preferred embodiments.
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Laubscher, Jr. Lawrence E.
Mitel Corporation
Vo Tuyet T.
Wong Don
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