Vertical routing structure

Details Vertical routing structure Vertical routing structure

2005-09-20

2005-09-20

Eckert, George (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S700000, C257S773000

Reexamination Certificate

active

06946727

ABSTRACT:
A vertical routing structure inside a substrate for connecting a pair of trace lines electrically. The trace lines are positioned on the top and bottom surface of a stack layer. The vertical routing structure includes a conductive rod and two bonding pads. The conductive rod passes through the stack layer such that the top and bottom surface of the conductive rod are also exposed on the top and bottom surface of the stack layer. In addition, a bonding pad is also attached to the top and bottom surface of the conductive rod respectively. The bonding pads are connected to the aforementioned trace lines. The two bonding pads have a transverse sectional area smaller than the transverse sectional area of the conductive rod. Thus, the vertical routing structure is able to reduce surface area needed to accommodate inter-layer connections and increase routing density within the substrate.

REFERENCES:
patent: 4667219 (1987-05-01), Lee et al.
patent: 6424048 (2002-07-01), Umetsu et al.
patent: 6611012 (2003-08-01), Miyamoto et al.
patent: 19853703 (2000-05-01), None

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