Vertical right angle solderless interconnects from suspended str

Details Vertical right angle solderless interconnects from suspended str Vertical right angle solderless interconnects from suspended str

1995-12-26

1997-05-27

Gensler, Paul

Wave transmission lines and networks

Coupling networks

With impedance matching

333246, H01P 508

Patent

active

056336152

ABSTRACT:
An interconnection apparatus for providing solderless, three dimensional microwave interconnection from a planar suspended substrate stripline network to MIC modules using three wire transmission line input/output ports. The apparatus includes in sequence a coaxial line transition which is coupled to the stripline center conductor, a slabline transition coupled to the coaxial line transition. A center conductor having a constant diameter extends through the coaxial and slabline transition. A short three wire transition couples the slabline transition to the three wire transmission line input/output port, and uses compressible conductors as the wire elements to provide a robust solderless connection to the three wire transmission line port.

REFERENCES:
patent: 4837529 (1989-06-01), Gawronski et al.
patent: 4995815 (1991-02-01), Buchanan et al.
patent: 5416453 (1995-05-01), Quan

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