Metal fusion bonding – Process of disassembling bonded surfaces – per se
Reexamination Certificate
2008-04-08
2008-04-08
Kerns, Kevin P. (Department: 1793)
Metal fusion bonding
Process of disassembling bonded surfaces, per se
C228S119000
Reexamination Certificate
active
10695187
ABSTRACT:
A method for vertical removal of excess solder from a circuit substrate includes the use of a sacrificial circuit substrate with a plurality of pads and vias that are solder-wettable. The pads and vias of the sacrificial circuit substrate are placed in vertical proximity to the excess solder of the circuit substrate. The excess solder is heated until it is liquid, wherein the excess solder is wicked vertically onto the pads and into the vias of the sacrificial circuit substrate. Thereafter, the sacrificial circuit substrate is lifted from the proximity of the circuit substrate while the solder is in a liquid, taking the excess solder with it but leaving a predetermined amount on the circuit substrate.
REFERENCES:
patent: 3580462 (1971-05-01), Vanyi
patent: 3618846 (1971-11-01), Poli
patent: 3661315 (1972-05-01), Helton
patent: 3751799 (1973-08-01), Reynolds
patent: 4877175 (1989-10-01), Jones et al.
patent: 5143272 (1992-09-01), Carlomagno et al.
patent: 5227589 (1993-07-01), Weeks
patent: 5242100 (1993-09-01), Weeks
patent: 5282565 (1994-02-01), Melton
patent: 5392980 (1995-02-01), Swamy et al.
patent: 5762259 (1998-06-01), Hubacher et al.
patent: 5921462 (1999-07-01), Gordon
patent: 5929518 (1999-07-01), Schlaiss
patent: 5934545 (1999-08-01), Gordon
patent: 6156408 (2000-12-01), Zhou et al.
patent: 6641865 (2003-11-01), Hertz
patent: 2003/0019918 (2003-01-01), Farooq et al.
patent: 09260835 (1997-03-01), None
Babula Robert
Gall Thomas P.
Herbold James E.
Sharkey Steven G.
Weigler William C.
Kerns Kevin P.
Temic Automotive of North America, Inc.
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