Vertical probe card apparatus with macro-tension module having n

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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324758, 324754, G01R 3102

Patent

active

058501487

ABSTRACT:
The present invention relates to a probe card for testing the failure of a semiconductor IC chip. The probe card according to the present invention comprises a vertical needle module having an upper fixing plate and a lower fixing plate through which vertical-type needles are attached; a mass ring attached to the vertical needle module for smooth contact of the vertical-type needles with pads of a semiconductor IC chip; a guide ring for smooth movement of the mass ring and the vertical needle module and for protecting the mass ring and the vertical needle module against deviation in a downward direction; a space forming means for obtaining a movement space of the mass ring, in which the means is placed above the guide ring; and a probe card PCB, on which a signal pattern is formed, formed on the space forming means, thereby protecting the upper fixing plate from movements in a lateral direction and to protect the needle module against deviations in an upper direction. The probe card can make smooth contacts between the pads formed on an upper portion of a semiconductor IC chip and the vertical-type needles and is also capable of testing a multiple of semiconductor IC chips simultaneously.

REFERENCES:
patent: 3806801 (1974-04-01), Bove
patent: 3911361 (1975-10-01), Bove et al.
patent: 5266895 (1993-11-01), Yamashita
patent: 5325052 (1994-06-01), Yamashita
patent: 5518410 (1996-05-01), Masami
patent: 5525911 (1996-06-01), Marumo et al.
patent: 5539676 (1996-07-01), Yamaguchi

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