Vertical probe card and method for using the same

Details Vertical probe card and method for using the same Vertical probe card and method for using the same

2005-03-01

2005-03-01

Cuneo, Kamand (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S761010, C324S1540PB, C324S754090, C257S048000

Reexamination Certificate

active

06861858

ABSTRACT:
A vertical probe card for testing electronic devices includes a multi-layer ceramic substrate mounted on a printed circuit board. The multi-layer ceramic substrate provides a plurality of vertical probes arranged in a planar array and formed on the surface of the multi-layer ceramic substrate by micro-fabrication technology. The method of using the vertical probe card includes disposing a device to be tested under the card, aligning the card's probes with the I/O terminals of the device, and contacting the device with the card's ceramic substrate so that all of the contact portions of the I/O terminals are contacted and deformed by the probes. The relative positions of the electronic device and the apparatus are maintained while Automatic Test Equipment tests the device.

REFERENCES:
patent: 5477160 (1995-12-01), Love
patent: 5831441 (1998-11-01), Motooka et al.
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patent: 6292003 (2001-09-01), Fredrickson et al.
patent: 6616966 (2003-09-01), Mathieu et al.
K. F. Greene, et al., “Flexible Contact Probe,” IBM Technical Disclosure Bulletin, vol. 15, No. 5, p. 1513, Oct. 1972.

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