Vertical power component

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including high voltage or high power devices isolated from...

Reexamination Certificate

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C257S500000

Reexamination Certificate

active

06903435

ABSTRACT:
A vertical power component on a silicon wafer, including a lightly-doped epitaxial layer of a second conductivity type on the upper surface of a heavily-doped substrate of a first conductivity type, the epitaxial layer having a thickness adapted to withstanding the maximum voltage likely to be applied to the power component during its operation; and an isolating wall formed by etching a trench through the epitaxial layer and diffusing from this trench a dopant of the first conductivity type of high doping level.

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French Search Report from French Patent Application 99 14012, filed Nov. 3, 1999.
Patent Abstracts of Japan, vol. 006, no. 077 (E-106), May 14, 1982 & JP 57 017145 A (Fujitsu Ltd).

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