Vertical package mounted on both sides of a printed circuit boar

Details Vertical package mounted on both sides of a printed circuit boar Vertical package mounted on both sides of a printed circuit boar

1995-08-21

1997-09-23

Ledynh, Bot L.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361764, 361772, 361777, 361783, 174260, 174262, 174267, H05K 702, H05K 116

Patent

active

056711255

ABSTRACT:
Two flat packages (110, 111) are arranged to achieve a mirrored footprint by employing guides (100), which are positioned within a mounting aperature a printed circuit board. The flat packages include leads (120, 121) which extend from an edge of the flat package. A semiconductor chip is encapsulated by the flat packages.

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