Semiconductor device manufacturing: process – Making passive device – Stacked capacitor
Reexamination Certificate
2005-10-31
2008-08-26
Baumeister, Bradley W. (Department: 2891)
Semiconductor device manufacturing: process
Making passive device
Stacked capacitor
C438S253000, C438S387000, C257S303000, C257S306000, C257S532000, C257SE21008
Reexamination Certificate
active
07416953
ABSTRACT:
A method of fabricating a vertical MIM capacitor. An insulation layer is formed on the substrate. The insulation layer is patterned to form an opening in a predetermined area of a core electrode. Then, the opening is filled to form a sacrificial plug. Subsequently, the insulation layer is patterned to form a trench in a predetermined area of an outer electrode around the sacrificial plug. A fenced insulation layer is formed around the sacrificial plug simultaneously. After the sacrificial plug is removed, a metal layer is filled in the predetermined area of the core and outer electrodes. A vertical MIM capacitor comprising the core electrode, the fenced insulation layer, and the outer electrode is finally formed. The invention also provides a vertical MIM capacitor.
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S. Wolf and R.N. Tauber Silicon Processing for the VLSI vol. 1—Process Technology Lattice Press, USA (2000).
Lee Charles
Wu Chi-Hsi
Baumeister Bradley W.
Taiwan Semiconductor Manufacturing Co. Ltd.
Thomas Kayden Horstemeyer & Risley
Ward Eric
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