Vertical integrated circuit package integration

Details Vertical integrated circuit package integration Vertical integrated circuit package integration

1980-09-11

1983-08-09

Tolin, G. P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361396, 339 17CF, 357 75, H05K 702

Patent

active

043982352

ABSTRACT:
A compact assembly of similar type integrated circuit packages having a functionally similar terminal lead in non-corresponding lead positions. Two interconnection packages, of a type similar to the integrated circuit packages, are nested between the integrated circuit packages to re-route an electrical path from a terminal lead location on one integrated circuit package to a functionally similar but differently located lead position on the other integrated circuit package.

REFERENCES:
patent: 3268774 (1966-08-01), Ortner
patent: 3316455 (1967-04-01), Hucke
patent: 3340439 (1967-09-01), Henscher
patent: 3370203 (1968-02-01), Kravitz
patent: 3403300 (1968-09-01), Horowitz
patent: 3515949 (1970-06-01), Michaels
patent: 3627901 (1971-12-01), Happ
patent: 3697818 (1972-10-01), Boursin
patent: 4080026 (1978-03-01), Gianni
patent: 4252390 (1981-02-01), Bowling
patent: 4254446 (1981-03-01), Peoples
S. Gerson, "Package Piggybacks Standard E-Prom to Emulate . . . Computers", Electronics, 1/31/80, pp. 89-92.

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