Vertical indent production repair

Details Vertical indent production repair Vertical indent production repair

2007-09-17

2010-11-09

Louie, Wai-Sing (Department: 2814)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Substrate dicing

C438S068000, C438S113000, C438S458000, C438S460000, C438S462000, C257SE21214

Reexamination Certificate

active

07829360

ABSTRACT:
A method of nanomachining is provided. The method includes plunging a nanometer-scaled tip into a surface of a substrate at a first location in a first direction that is substantially perpendicular to the surface, thereby displacing a first portion of the substrate with the tip. The method also includes withdrawing the tip from the substrate in a second direction that is substantially opposite to the first direction. The method further includes moving at least one of the tip and the substrate laterally relative to each other. In addition, the method also includes plunging the tip into the substrate at a second location in a third direction that is substantially parallel to the first direction, thereby displacing a second portion of the substrate with the tip and withdrawing the tip from the substrate in a fourth direction that is substantially opposite to the third direction.

REFERENCES:
patent: 2005/0250296 (2005-11-01), Yamamura et al.
patent: 2006/0166465 (2006-07-01), Ono
patent: 2008/0070380 (2008-03-01), Kusunoki

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