Material or article handling – Apparatus for moving material between zones having different... – For carrying standarized mechanical interface type
Patent
1993-02-04
1995-02-14
Bucci, David A.
Material or article handling
Apparatus for moving material between zones having different...
For carrying standarized mechanical interface type
118719, 20429825, 414939, 414786, B65G 4907
Patent
active
053889444
ABSTRACT:
A wafer loading and unloading chamber is provided at the bottom of a reaction tube of a heat treatment section, a robot chamber and cassette chamber are coupled via gate valves to the wafer loading and unloading chamber, the robot chamber comprises a first load lock chamber while the wafer loading and unloading chamber comprises a second load lock chamber. These first and second load lock chambers are mutually connected by a pressure balancing gas conduit via pressure balancing valves. During heat treatment of the target objects, the wafer loading and unloading chamber and robot chamber are first set to inert gas atmospheres, then the pressure balancing gas conduit valves are opened to balance the pressures of the robot and cassette chambers. Gate valves between these chambers are then opened, and the cassette is conveyed via the robot chamber to a wafer boat in the wafer loading and unloading chamber. By this process gas flow between the two chambers when the gate valves are opened is suppressed to allow minimizing the production of particles.
REFERENCES:
patent: 4388034 (1983-06-01), Takahashi
patent: 4442338 (1984-04-01), Yamazaki
patent: 4725204 (1988-02-01), Powell
patent: 4785962 (1988-11-01), Toshima
patent: 4797054 (1989-01-01), Arii
patent: 4825808 (1989-05-01), Takahashi et al.
patent: 4883020 (1989-11-01), Kasai et al.
patent: 4938691 (1990-07-01), Ohkase et al.
patent: 4962726 (1990-10-01), Matsushita et al.
patent: 4990047 (1991-02-01), Wagner et al.
patent: 5002793 (1991-03-01), Arai
patent: 5207578 (1993-05-01), Sakata
patent: 5223001 (1993-06-01), Saeki
Noguchi Tadataka
Suzuki Takeo
Takanabe Eiichiro
Bucci David A.
Tokyo Electron Tohoku Kabushiki Kaisha
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