Vertical grounded coplanar waveguide H-bend interconnection appa

Details Vertical grounded coplanar waveguide H-bend interconnection appa Vertical grounded coplanar waveguide H-bend interconnection appa

1995-06-05

1996-10-01

Gensler, Paul

Wave transmission lines and networks

Coupling networks

With impedance matching

333246, 333260, H01P 500

Patent

active

055614051

ABSTRACT:
Interconnection apparatus providing a right angle H-plane bend in grounded coplanar waveguide (GCPW) transmission line media. Respective first and second GCPW lines include a dielectric substrate, on which is formed on a bottom surface a bottom conductive ground plane, and on a top surface is formed a center conductor strip sandwiched between first and second top ground plane strips. The two GCPW lines are disposed orthogonally, forming a corner junction at which corresponding bottom and top ground planes, and the center conductor strips, of the lines are electrically connected. The gaps between corresponding top ground plane strips and the center conductor strips have regions of increased gap width at the corner junction to compensate for the capacitance resulting from the junction.

REFERENCES:
patent: 2790148 (1957-04-01), Kostriza
patent: 3093805 (1963-06-01), Osifchin et al.
patent: 3573670 (1971-04-01), Skobern
patent: 4429289 (1984-01-01), Higgins, Jr. et al.
patent: 5200719 (1993-04-01), Margulis et al.
patent: 5294897 (1994-03-01), Notani et al.

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