Vertical and lateral isolation for a semiconductor device

Fishing – trapping – and vermin destroying

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437927, 437 61, 437154, H01L 2176

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053895690

ABSTRACT:
A method is provided for making a power device (54) and a small signal device (52) on a bonded silicon substrate (41). A first silicon substrate (10) provided. A first surface (17) is etched to form a plurality of cavities (11) with a depth (13). A dielectric layer (14) is created on the first surface (17), wherein the dielectric layer (14) is created with a thickness less than or equal to the depth of the plurality of cavities. The dielectric layer (14) is patterned so that a plurality of islands (22) of dielectric remain in the cavities. A second silicon substrate (42) is provided. The first and the second silicon substrates (10, 42) are bonded together in such a manner that the islands (22) are buried. A predetermined portion of the first silicon substrate (10) is removed, thereby creating a surface that is suitable for semiconductor device fabrication.

REFERENCES:
patent: 4631803 (1986-12-01), Hunter et al.
patent: 4638552 (1987-01-01), Shinbo et al.
patent: 4710794 (1987-12-01), Koshino et al.
patent: 4881115 (1989-11-01), Lesk et al.
patent: 5204282 (1993-04-01), Tsurata et al.
Haisma J., et al, "Silicon on Insulator . . . Evaluations", Japanese J. Appl. Phys. vol. 28, No. 8 (1989), pp. 1426-1443.

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