Cleaning and liquid contact with solids – Processes – With work or work parts movable during treatment
Reexamination Certificate
2007-03-27
2007-03-27
Stinson, Frankie L. (Department: 1746)
Cleaning and liquid contact with solids
Processes
With work or work parts movable during treatment
C134S153000, C134S067000, C134S902000, C134S147000
Reexamination Certificate
active
10601016
ABSTRACT:
The present invention provides a system (200, 300) for remediating aberrations along the perimeter of a semiconductor wafer (202). The system includes a cleaning apparatus (204) within which the wafer is spun within a confined area. A chuck (208) defines the confined area, having a sidewall that extends above the upper surface (214) of the wafer and surrounds the perimeter of the wafer. The chuck also has a bottom wall, with an aperture formed therein, beneath the wafer. The system includes an isolation barrier (220), disposed atop the bottom wall of the chuck and around the aperture, in proximity to the lower surface so of the wafer. This forms a narrow gap (226) between the barrier and the wafer. A pressurized source forcefully directs a gas (218) at and along the lower surface of the wafer. The system also includes a remediation solution (228) that is applied to the upper surface of the wafer. The solution is forced into a well (230) formed between the chuck sidewall and the perimeter of the wafer, such that the solution bathes the perimeter of the wafer.
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Hurd Trace Q.
Xia Changfeng
Brady III W. James
McLarty Peter K.
Stinson Frankie L.
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
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