Venting hole designs for multilayer conductor-dielectric structu

Details Venting hole designs for multilayer conductor-dielectric structu Venting hole designs for multilayer conductor-dielectric structu

1997-05-20

2000-08-22

Ahmad, Nasser

Stock material or miscellaneous articles

Structurally defined web or sheet

Including aperture

174254, 257786, 428134, 428136, 428137, 428138, B32B 310, H01L 2348, H05K 100

Patent

active

06106923&

ABSTRACT:
Disclosed are venting hole structures suitable for AC grounding planes in multichip modules (MCMs) and the like. Such structures may be constructed from alternating layers of metal and dielectric materials, such as copper and polyimide, respectively. The venting structures according to the present invention are formed in the metal layers of grounding planes and enable gases trapped within the underlying dielectric layers to escape (so as to prevent delamination) without disturbing the function of the AC grounding plane to provide controlled impedance characteristics for signal lines disposed above and below the grounding plane.

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