Ventilated housing for electronic components

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C361S727000, C312S223100, C312S236000

Reexamination Certificate

active

11232399

ABSTRACT:
A structure for vertically housing an electronic component is disclosed as including a bottom support member and a top support member. The top support member is substantially parallel to the bottom support member. An open space is formed between the top support member and the bottom support member whereby the electronic component may be placed into the open space in a vertical orientation. A ventilating structure is disposed outside of the open space and is capable of channeling air into a middle portion of the electronic component in the open space.

REFERENCES:
patent: 4672509 (1987-06-01), Speraw
patent: 5027254 (1991-06-01), Corfits et al.
patent: D367849 (1996-03-01), Pedinielli et al.
patent: 5506751 (1996-04-01), Chatel
patent: 5544008 (1996-08-01), Dimmick et al.
patent: 5896273 (1999-04-01), Varghese et al.
patent: D409171 (1999-05-01), Wu
patent: 5940288 (1999-08-01), Kociecki
patent: 6052278 (2000-04-01), Tanzer et al.
patent: 6129429 (2000-10-01), Hardt et al.
patent: 6192401 (2001-02-01), Modiri et al.
patent: 6288902 (2001-09-01), Kim et al.
patent: 6317334 (2001-11-01), Abruzzini et al.
patent: 6480391 (2002-11-01), Monson et al.
patent: 6487080 (2002-11-01), Robbins et al.
patent: 6490152 (2002-12-01), White et al.
patent: 6525935 (2003-02-01), Casebolt
patent: 6885554 (2005-04-01), Reeck et al.
patent: 6975510 (2005-12-01), Robbins et al.
patent: 2002/0141156 (2002-10-01), Edmunds et al.
patent: 2003/0021091 (2003-01-01), Robbins et al.
patent: 2003/0081381 (2003-05-01), Moizer
patent: 2003/0128513 (2003-07-01), Wiley
patent: 2003/0223199 (2003-12-01), Smith et al.
patent: 2003/0231467 (2003-12-01), Replogle et al.
patent: 2004/0057216 (2004-03-01), Smith et al.
PICMG PC Industrial Computers, InfinitBand for AdvancedTCA Systems Short Form Specification, Jan. 22, 2003.
PICMG PC Industrial Computers, AdvancedTCA PICMG 3.0 Short Form Specifications, Jan. 2003.
PICMG PC Industrial Computers, CompactPCI, PICMG 2.20 R1.0, Serial Mesh Backplane Short Form Specification, Oct. 21, 2002.
PICMG PC Industrial Computers, CompactPCI, PICMG 2.14 R1.0, MultiComputing Short Form Specification, Sep. 6, 2001.
PICMG PC Industrial Computers, CompactPCI PICMG 2.16 Revision 1.0, Packet Switching Backplane Short Form Specification, Sep. 5, 2001.
PICMG PC Industrial Computers, CompactPCI PICMG 2.15 Revision 1.0, PCI Telecom Mezzanine/Carrier Card Short Form Specification, Apr. 11, 2001.
PICMG PC Industrial Computers, CompactPCI, PICMG 2.11 Revision 1.0 Power Interface Short Form Specification, Oct. 1, 1999.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Ventilated housing for electronic components does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Ventilated housing for electronic components, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ventilated housing for electronic components will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3848783

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.