Vented circuit board for cooling power components

Details Vented circuit board for cooling power components Vented circuit board for cooling power components

2005-12-20

2005-12-20

Cuneo, Kamand (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S255000, C174S262000

Reexamination Certificate

active

06977346

ABSTRACT:
The present invention provides a circuit board including a first conductor layer forming a plurality of conductive circuit traces for interconnecting electronic components. The circuit board includes a substrate for supporting the first conductor layer and a pedestal formed from the substrate for supporting at least one of the plurality of electronic components. The pedestal provides a heat conduction path for conducting heat away from the at least one of the plurality of electronic components and a aperture in the substrate adjacent the pedestal for allowing a fluid to pass through the substrate.

REFERENCES:
patent: 3801388 (1974-04-01), Akiyama et al.
patent: 4404059 (1983-09-01), Livshits et al.
patent: 4839774 (1989-06-01), Hamburgen
patent: 5049982 (1991-09-01), Lee et al.
patent: 5738797 (1998-04-01), Belke, Jr. et al.
patent: 6205028 (2001-03-01), Matsumura
patent: 6365057 (2002-04-01), Whitehurst et al.
patent: 6391211 (2002-05-01), Glovatsky et al.

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