Vent chimney heat sink design for an electrical assembly

Details Vent chimney heat sink design for an electrical assembly Vent chimney heat sink design for an electrical assembly

1998-09-11

2000-04-04

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361703, 361709, 361717, 361719, 361749, 257687, 257706, 257717, 174 163, 174 524, 165 803, 165185, H05K 720

Patent

active

060469064

ABSTRACT:
An electronic assembly which includes a heat sink. The assembly includes first and second integrated circuit packages that are mounted to a substrate. The heat sink may be in direct thermal contact with the first integrated circuit package and include a channel that is located adjacent to the second integrated circuit package. The channel allows air to flow across the second integrated circuit package and remove heat generated within the package.

REFERENCES:
patent: 5280409 (1994-01-01), Selna et al.
patent: 5396403 (1995-03-01), Patel
patent: 5831828 (1998-11-01), Cutting et al.
patent: 5831830 (1998-11-01), Mahler
patent: 5847928 (1998-12-01), Hinshaw
patent: 5870288 (1999-02-01), Chen

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