VCSEL with integrated lens

Details VCSEL with integrated lens VCSEL with integrated lens

2007-05-29

2007-05-29

Mulpuri, Savitri (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C438S027000, C257SE33072

Reexamination Certificate

active

10794252

ABSTRACT:
A wafer-level device fabrication process forms standing structures around emitting areas of multiple VCSELs. The standing structures can be shaped to hold ball lenses or other optical elements for respective VCSELs or can include platforms on which optical elements are formed. Ball lenses that are attached to the standing structures either during chip-level or wafer-level processes fit into the standing structures and are automatically aligned. Wafer level fabrication of optical elements can align the optical elements with accuracies associated with photolithographic processes. The optical elements can be formed using a molding or replication process, a printing method, or surface tension during a reflow of lithographically formed regions.

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Karlsson, M. et al., “Monolithic Integration of Continuous-Relief Diffractive Structures With Vertical-Cavity Surface-Emitting Lasers” IEEE Photonics Technology Letters vol. 15, No. 3, (Mar. 2003) pp. 359-361.

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