Varnish for laminate or prepreg, laminate or prepreg...

Stock material or miscellaneous articles – Printed circuit

Reexamination Certificate

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Details

C428S297400, C428S396000, C428S413000, C428S414000, C428S416000, C428S418000, C523S400000, C523S461000

Reexamination Certificate

active

07041399

ABSTRACT:
Disclosed are a varnish for laminate or prepreg, comprising a heat treatment product which is obtained by mixing together (a) an epoxy resin, (b) dicyandiamide, and (c) a compound having an imidazole ring so that the component (c) is present in an amount of 0.001 to 0.03% by weight, based on the weight of the component (a), and subjecting the resultant mixture to reaction for heat treatment in an organic solvent at a temperature of 70° C. to less than 140° C. so that all of the components are compatible with one another in the absence of a solvent; and (d) inorganic filler, a laminate or prepreg prepared using the varnish and a printed wiring board prepared using the laminate and/or prepreg.

REFERENCES:
patent: 4923910 (1990-05-01), Kitagawa et al.
patent: 5837355 (1998-11-01), Hayai
patent: 5994429 (1999-11-01), Honda et al.
patent: 0 472 830 (1992-03-01), None
patent: 59-038235 (1984-03-01), None
patent: 06-100763 (1994-04-01), None
patent: 06-100764 (1994-04-01), None
patent: 08-003283 (1996-01-01), None
patent: 09-263647 (1997-10-01), None
patent: 2000-136292 (2000-05-01), None
Machine translation of JP 06-100763, provided by the JPO website.
Machine translation of JP 06-100764, provided by the JPO website.
International Search Report for No. PCT/JP01/10884, mailed Mar. 12, 2002.
Supplementary European Search Report, for Application No. 01270570.3-2102 PCT/JP01/10884, dated Sep. 5, 2005.

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