Variable-wedge thermal-interface device

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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C361S710000, C165S080300, C257S706000

Reexamination Certificate

active

06985359

ABSTRACT:
A variable-gap thermal-interface device for transferring heat from a heat source to a heat sink is provided. The device comprises a multi-axis rotary spherical joint comprising a spherically concave surface having a first radius of curvature in slideable contact with a spherically convex surface having the same first radius of curvature. The device further comprises a block having a proximal end rotatably coupled with the heat sink through the rotary spherical joint and having a distal end opposite the proximal end. The device further comprises a wedge having a variable thickness separating a first surface and a second surface opposite and inclined relative to the first surface, such that the first surface is thermally coupled with the distal end of the block, and the second surface is thermally coupled with the heat source.

REFERENCES:
patent: 3573574 (1971-04-01), Davis
patent: 4561011 (1985-12-01), Kohara et al.
patent: 5162974 (1992-11-01), Currie
patent: 6046498 (2000-04-01), Yoshikawa
patent: 6691768 (2004-02-01), Hsieh et al.
patent: 360046056 (1985-03-01), None
The Article “Articulated Thermal Conductor for Semiconductor Packages” IBM Technical Disclosure Bulletin, Jan. 1978, vol. 20, Issue 8, pp. 3131-3132.
The Article “Swivel Piston Conduction Module” IBM Technical Disclosure Bulletin, Dec. 1977, vol. 20, Issue 7, pp. 2707=2708.
Delano, Andrew D. et al., “Variable-Gap Thermal-Interface Device,” filed Apr. 21, 2003.
Belady, Christian, L. et al., Thermal Transfer Interface System and Methods, U.S. Appl. No. 10/074,642, filed Feb. 12, 2002.
http://www.bergquistcompany.com/tm—gap—list.cfm, p. 1-2, (Mar. 3, 2003).
http://www.bergquistcompany.com/tm—gap—pad—detail.cfm, p. 1-2, (Mar. 3, 2003).
Rubenstein, Brandon A. et al., “Heat Sink Hold-Down with Fan-Module Attach Location,” filed Apr. 21, 2003.
The Article “Spherical Cooling Device” IBM Technical Disclosure Bulletin, Jul. 1991, vol. 34, Issue 2, pp. 1-3.

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