Variable thickness pads on a substrate surface

Details Variable thickness pads on a substrate surface Variable thickness pads on a substrate surface

2005-05-31

2005-05-31

Cuneo, Kamand (Department: 2827)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S778000, C257S686000, C257S786000

Reexamination Certificate

active

06900545

ABSTRACT:
An electronic structure, and associated method of fabrication, that includes a substrate having attached circuit elements and conductive bonding pads of varying thickness. Pad categories relating to pad thickness include thick pads (17 to 50 microns), medium pads (10-17 microns), and thin pads (3 to 10 microns). A thick pad is used for coupling a ball grid array (BGA) to a substrate with attachment of the BGA to a circuit card. A medium pad is useful in flip-chip bonding of a chip to a substrate by use of an interfacing small solder ball. A thin copper pad, coated with a nickel-gold layer, is useful for coupling a chip to a substrate by use of a wirebond interface. The electrical structure includes an electrical coupling of two pads having different thickness, such that the pads are located either on the same surface of a substrate or on opposite sides of a substrate.

REFERENCES:
patent: 3343256 (1967-09-01), Smith et al.
patent: 3518751 (1970-07-01), Waters
patent: 3715635 (1973-02-01), Michel et al.
patent: 4021838 (1977-05-01), Warwick
patent: 4191789 (1980-03-01), Brown et al.
patent: 4718977 (1988-01-01), Contiero et al.
patent: 4791006 (1988-12-01), Galvagni et al.
patent: 4959510 (1990-09-01), Matsusaka et al.
patent: 5001605 (1991-03-01), Savagian et al.
patent: 5208658 (1993-05-01), Murata
patent: 5214308 (1993-05-01), Nishiguchi et al.
patent: 5249101 (1993-09-01), Frey et al.
patent: 5294486 (1994-03-01), Paunovic et al.
patent: 5541368 (1996-07-01), Swamy
patent: 5541369 (1996-07-01), Tahara et al.
patent: 5592736 (1997-01-01), Akram et al.
patent: 5594275 (1997-01-01), Kwon et al.
patent: 5629835 (1997-05-01), Mahulikar et al.
patent: 5638597 (1997-06-01), Cutting et al.
patent: 5640047 (1997-06-01), Nakashima
patent: 5677566 (1997-10-01), King et al.
patent: 5706178 (1998-01-01), Barrow
patent: 5739585 (1998-04-01), Akram et al.
patent: 5767008 (1998-06-01), Haji
patent: 5767575 (1998-06-01), Lan et al.
patent: 5784262 (1998-07-01), Sherman
patent: 5885400 (1999-03-01), Davis et al.
patent: 5977640 (1999-11-01), Bertin et al.
patent: 6031292 (2000-02-01), Murakami et al.
patent: 6050832 (2000-04-01), Lee et al.
patent: 6080494 (2000-06-01), Abbott
patent: 6144090 (2000-11-01), Higashiguchi
patent: 6162664 (2000-12-01), Kim
patent: 6221682 (2001-04-01), Danziger et al.
patent: 6335104 (2002-01-01), Sambucetti et al.
patent: 6365978 (2002-04-01), Ibnabdeljalil et al.
patent: 6366466 (2002-04-01), Leddige et al.
patent: 6583503 (2003-06-01), Akram et al.
patent: 2002/0000665 (2002-01-01), Barrr et al.
patent: 62-145851 (1987-06-01), None
patent: 02-43748 (1990-02-01), None
patent: 05-615323 (1993-11-01), None
patent: 06-198936 (1994-07-01), None
patent: 10032371 (1998-02-01), None
patent: 100093215 (1998-04-01), None
patent: 11-307678 (1999-11-01), None
patent: 019743767 (1998-07-01), None

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