Variable spring rate thermal management apparatus attachment...

Details Variable spring rate thermal management apparatus attachment... Variable spring rate thermal management apparatus attachment...

2005-08-31

2009-08-04

Datskovskiy, Michael V (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S720000, C165S080300, C165S104330, C165S185000, C174S016300

Reexamination Certificate

active

07570490

ABSTRACT:
A device to thermally couple a thermal management apparatus to at least one heat generating component of a circuit substrate includes at least a first portion that is adapted to couple to the thermal management apparatus, and at least a second portion that is adapted to couple to the thermal management apparatus. The first portion and the second portion may be symmetrically arranged relative to each other. The first portion and the second portion are adapted to thermally couple the thermal management apparatus to the heat generating component with a first spring bias. The first portion and the second portion are further adapted to maintain the thermal management apparatus thermally coupled to the heat generating component with a second spring bias.

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