Variable pitch IC bond pad arrangement

Details Variable pitch IC bond pad arrangement Variable pitch IC bond pad arrangement

1986-10-20

1988-06-28

Beck, Shrive P.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

357 55, 174 52FP, B05D 512

Patent

active

047538201

ABSTRACT:
The bond pads (22) for a ceramic package (10) are deposited on the pre-fired ceramic with the bond pad widths (47) increasing as a function of the distance (49) of each pad from the center of package mass (40), whereby bond pads at the extremity (36) of the package have the largest pad width and pads toward the center (40) of the package have the narrowest width.

REFERENCES:
patent: 3965552 (1976-06-01), Rutt
patent: 4535219 (1985-08-01), Sliwa
patent: 4546065 (1985-10-01), Amendola
patent: 4590095 (1986-05-01), Park
patent: 4618739 (1986-10-01), Theobald

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