Variable control of carrier curvature with direct feedback loop

Abrading – Precision device or process - or with condition responsive... – Computer controlled

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Details

451 55, 451287, 451288, 451388, 451398, B24B 501

Patent

active

060302755

ABSTRACT:
A semiconductor wafer carrier for holding a wafer is provided, where the wafer has edge portions and central portions. The carrier has a fixed permanent magnet having portions defining a cavity and a first coil slidably disposed within the cavity of the fixed permanent magnet. Also provided is a speaker cone having a conical portion and a diaphragm portion. The conical portion has a first end of a first diameter and a second end of a second diameter larger than the first diameter. The first end is fixed to the first coil. The diaphragm covers the second end and has edge portions constrained from movement and central portions free to deflect. A backing film is sealingly affixed to the diaphragm for isolating the speaker from the outside environment. Lastly, a wafer retaining means is provided for retaining the wafer against the backing film along its edge portions. With the application of a voltage to the first coil, the first coil is made to translate within the cavity of the permanent magnet which in turn results in the diaphragm, backing film, and wafer affixed thereto to deflect a predetermined distance at their central portions.

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