Cutting – Processes – Plural cutting steps
Patent
1990-12-12
1992-08-25
Phan, Hien H.
Cutting
Processes
Plural cutting steps
83 50, 83 52, 83571, 83622, 234 1, 234 49, B26F 104
Patent
active
051408791
ABSTRACT:
A system is provided which utilizes a plurality of sequentially controlled magnetic repulsion punches arranged in a variable array to punch a constantly moving substrate. These punches are disposed adjacent the constant velocity substrate on which holes, or vias are formed as the punches are sequentially fired. The array of punches is placed at an angle with respect to the perpendicular of the direction of movement of the substrate. Thus, a delay is present between the time when the first punch must be fired and the firing of subsequent punches, due to the angle of the array. Therefore, due to this delay between the time the first punch must energized, and the energizing of subsequent punches a single power supply is capable of providing energy to a group of punches. Further, with the system of the present invention, it is possible to punch rows of holes lying in straight rows perpendicular to the direction of movement of the substrate and have different center to center distances on the same substrate, without the necessity of rearranging the array of punches and performing an additional punching operation.
REFERENCES:
patent: 3073196 (1963-01-01), Marcalus
patent: 4206858 (1980-06-01), DeLuca et al.
patent: 4209129 (1980-06-01), Haas et al.
patent: 4425829 (1984-01-01), Kranik et al.
patent: 4799411 (1989-01-01), Peake
patent: 4821614 (1989-04-01), Fleet et al.
patent: 4872381 (1989-10-01), Stroms
IBM, TDB, "Multiple Via Punch," vol. 13, No. 9, Feb. 1971, p. 2536.
IBM TDB, "Programmable Cluster Punching System," vol. 16, No. 12, May 1974, p. 3921.
IBM TDB, "Air Spring Programmable Via Punching Head," vol. 16, No. 12, May 1974, pp. 3933-3934.
IBM TDB, "Automated Punch Apparatus for Forming Via Holes in a Ceramic Green Sheet," vol. 20, No. 4, Sep. 1977, pp. 1379-1380.
IBM TDB, "X-Y Positioning System for Punching," vol. 21, No. 11, Apr. 1979, pp. 4473-4475.
IBM TDB, "Automated Punch Apparatus Support Mechanism," vol. 26, No. 7B, Dec. 1983, pp. 3570-3572.
IBM TDB, "Punch Programming Mechanism," vol. 26, No. 10A, Mar. 1984, pp. 5100-5102.
IBM TDB, "Oscillating Punching Mechanism," vol. 30, No. 6, Nov. 1987, pp. 355-358.
IBM TDB, "Magneto Repulsion Punch Drive Circuit," vol. 31, No. 7, Dec. 1988, pp. 423-424.
IBM TDB, "Via Punching Device for Multi-Layered Ceramic Substrates," vol. 32, No. 7, Dec. 1989, pp. 255-257.
IBM TDB, "Flexpunch Machine," vol. 31, No. 9, Feb. 1989, pp. 140-142.
Frankeny Jerome A.
Haj-Ali-Ahmadi Javad
Hermann Karl
International Business Machines - Corporation
McBurney Mark E.
Phan Hien H.
Woods Raymond D.
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