Vapor reflow type soldering method and apparatus therefor

Details Vapor reflow type soldering method and apparatus therefor Vapor reflow type soldering method and apparatus therefor

1990-12-20

1992-10-20

Seidel, Richard K.

Metal fusion bonding

Process

With protecting of work or filler or applying flux

228 42, 228242, B23K 1015

Patent

active

051563258

ABSTRACT:
In case of suspending an apparatus upon the completion of soldering operation, from not smaller than 50% to less than 95% of a thermomedium in a reflow section is transferred to a filtering tank and the remaining thermomedium is made to pass through a water separator in advance of suspending the apparatus, so that water in the thermomedium is removed. This water removing operation makes it possible to prevent the corrosion of the reflow section and the deterioration of the thermomedium. Additionally, a method is disclosed for preventing water to be mixed with the thermomedium by warming the reflow section before operation.

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