Vapor reflow type soldering apparatus with an improved flux sepa

Details Vapor reflow type soldering apparatus with an improved flux sepa Vapor reflow type soldering apparatus with an improved flux sepa

1989-10-25

1991-03-05

Bennet, Henry A.

Drying and gas or vapor contact with solids

Apparatus

With means to treat gas or vapor

34 78, 118 61, F26B 2106

Patent

active

049967819

ABSTRACT:
A vapor reflow type soldering apparatus comprising a tank that is filled with saturated vapor of a heat medium and a passage extending through the tank. An article to be processed is transferred through the passage and is brought into contact with the saturated vapor so that a solder material on the article is heated and molten. Also, a discharge gas collecting unit is provided in the apparatus and includes a chilled water system through which water at a constant temperature is caused to flow. The heat medium is collected out of the discharge gas from the apparatus and is returned back to a tank. A flux separating unit is connected to the chilled water system of the discharge gas unit through a pipes and switching valves. The chilled water in the chilled water system is selectively introduced into the flux separating unit to cool the heat medium within the tank, and a flux molten into the heat medium is removed from the molten solder material.

REFERENCES:
patent: 4628616 (1986-12-01), Shirai et al.
patent: 4658513 (1987-04-01), Strattman
patent: 4735001 (1988-04-01), Mishina et al.
patent: 4776105 (1988-10-01), Mishina et al.
patent: 4809443 (1989-03-01), Mishina et al.

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