Vapor reflow type soldering apparatus

Details Vapor reflow type soldering apparatus Vapor reflow type soldering apparatus

1989-07-26

1991-08-13

Bennet, Henry A.

Drying and gas or vapor contact with solids

Apparatus

With means to treat gas or vapor

34231, F26B 2106

Patent

active

050384961

ABSTRACT:
A vapor reflow type soldering apparatus comprises a vapor generating tank disposed substantially centrally in the apparatus for receiving therein a thermal medium and saturated vapor of said thermal medium; a preheating chamber arranged upstream of the vapor generating tank; a cooling chamber arranged downstream of the vapor generating tank; an inlet side passage connecting the vapor generating tank and the preheating chamber; an outlet side passage connecting the vapor generating tank and the cooling chamber; a conveyor extending horizontally through the preheating chamber, the inlet side passage, the vapor generating tank, the outlet side passage and the cooling chamber, wherein the conveyor can vary the width thereof; an outlet side exhaust port provided at the outlet side passage; an inlet side cooler arranged beneath the inlet side passage and having a cover at an upper position thereof; an outlet side cooler arranged beneath the outlet side passage and extending close to the outlet side exhaust port; a lower vapor discharge opening formed below the conveyor within the vapor generating tank; and a shutter connected with a movable conveyor guide and also with the peripheral part of the lower vapor discharge opening, whereby the opening area of said lower vapor discharge opening can be varied as the movable conveyor guide is moved widthwise.

REFERENCES:
patent: 4389797 (1983-06-01), Spigarelli et al.
patent: 4628616 (1986-12-01), Shirai et al.
patent: 4735001 (1988-04-01), Mishina et al.
patent: 4766677 (1988-08-01), Brooks et al.
patent: 4776105 (1988-10-01), Mishina
patent: 4809443 (1989-03-01), Mishina
patent: 4897934 (1990-02-01), Peck

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