Vapor reflow type soldering apparatus

Drying and gas or vapor contact with solids – Apparatus – With means to treat gas or vapor

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Details

432194, 118729, 118 61, F26B 2106

Patent

active

051466945

ABSTRACT:
A vapor reflow type soldering apparatus with an upper supply hole of vapor for heating the upper surface of an article to be processed, the position of which is displaced to the downstream side along a direction of delivery with respect to that of a lower supply hole of vapor for heating the lower surface of the article, so that the temperature of the upper surface of the article to be processed can be raised more moderately than that of the lower surface thereof.

REFERENCES:
patent: 4291471 (1981-09-01), Bloom
patent: 4361967 (1982-12-01), Bahnsen et al.
patent: 4389797 (1983-06-01), Spigarelli et al.
patent: 4628616 (1986-12-01), Shirai et al.
patent: 4735001 (1988-04-01), Mishina et al.
patent: 4776105 (1988-10-01), Mishina et al.
patent: 4996781 (1991-03-01), Mishina et al.

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