Vapor reflow soldering apparatus

Details Vapor reflow soldering apparatus Vapor reflow soldering apparatus

1993-03-16

1994-08-02

Ramsey, Kenneth J.

Metal fusion bonding

With means to cool work or product

228222, 2282342, 219388, B23K 1015

Patent

active

053337743

ABSTRACT:
A vapor reflow soldering apparatus includes a unit for delivering an article processed to a vapor generating tank for generating saturated vapor of thermal medium, for allowing the article to be to come in contact with the saturated vapor, and for heating and melting solder of the article. A thermal medium recovery system collects thermal medium which flows in the article delivery path. There is also provided an arrangement for leading at least one part of exhaust gas containing mist from a recovery tank of the thermal medium recovery system for collecting and cooling thermal medium to the outlet-side delivery path for delivering the article. The exhaust gas with mist is blown off to the article being processed. The gas containing the mist is obtained by cooling the thermal medium in vapor phase state. The blown off gas containing mist to increases the cooling speed for the soldered part and the bonding strength, and reduces the consumption of thermal medium.

REFERENCES:
patent: 3773260 (1973-11-01), Kunioka et al.
patent: 4321031 (1982-03-01), Woodgate
patent: 4838476 (1989-06-01), Rahn
patent: 5146694 (1992-09-01), Mishina et al.
patent: 5156325 (1992-10-01), Mishina et al.

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