Vapor phase soldering system

Details Vapor phase soldering system Vapor phase soldering system

1987-09-10

1988-08-09

Jordan, M.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

2281801, B23K 304

Patent

active

047622644

ABSTRACT:
A processing vessel has two adjacent tanks each holding different electronic liquids. When heated the first will generate saturated vapor having a temperature below the liquidus temperature of eutectic solder and the second, when heated, will generate saturated vapor having a temperature above the liquidus temperature of eutectic solder. Work product is sequentially passed through these vapors and is first preheated and then reflowed.

REFERENCES:
patent: Re30399 (1980-09-01), Ammann et al.
patent: 4115601 (1978-09-01), Ammann et al.
patent: 4315042 (1982-02-01), Spigarelli
patent: 4612712 (1986-09-01), Pescatore et al.
patent: 4676069 (1987-06-01), Miyake
patent: 4681250 (1987-07-01), Derrico
patent: 4692114 (1987-09-01), Waldron et al.
patent: 4697730 (1987-10-01), Spigarelli et al.

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