Vapor phase etching MEMS devices

Details Vapor phase etching MEMS devices Vapor phase etching MEMS devices

2007-10-09

2007-10-09

Chen, Kin-Chan (Department: 1765)

Semiconductor device manufacturing: process

Chemical etching

Liquid phase etching

C438S706000, C216S073000

Reexamination Certificate

active

10464597

ABSTRACT:
An etch release for a MEMS device on a substrate includes etching the substrate with an etchant vapor and a wetting vapor. A thermal bake of the MEMS device, after the etch release may be used to volatilize residues. A supercritical fluid may also be used to remove residual contaminants. The combination of the etchant vapor, such as HF, and the wetting vapor, such as an alcohol vapor, improves the uniformity of the etch undercut on the substrate.

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